Denso and United Semiconductor Japan (USJC), a subsidiary of Taiwan-based United Microelectronics (UMC), have announced they will partner to manufacture automotive power semiconductors.
An insulated gate bipolar transistor (IGBT) line will be installed at USJC’s wafer fab, which will be the first in Japan to produce IGBTs on 300mm wafers, the companies said in a joint statement. Denso will contribute its system-oriented IGBT device and process technologies while USJC will provide its 300mm wafer manufacturing capabilities to bring the 300mm IGBT process into mass production, scheduled to start in the first half of 2023.
“Denso is very glad to be the member of first companies in Japan to start mass production of IGBTs on 300 mm wafers,” said company president Koji Arima in the statement. “Through this collaboration, we contribute to the stable supply of power semiconductors and electrification of automobiles.”
“We are pleased to have this win-win collaboration with a leading company such as Denso. This is an important project for UMC and will expand our relevance and influence in the automotive segment,” said UMC co-president Jason Wang in the same statement. “With our robust portfolio of advanced specialty technologies and IATF 16949 certified fabs in diversified locations, UMC is well placed to serve demand across auto applications, including advanced driver assistance systems, infotainment, connectivity, and powertrain.”
“As a key foundry player in Japan, USJC is committed to supporting the government’s strategy to boost domestic semiconductor production and the transition to more environmentally friendly electric vehicles,” noted Michiari Kawano, president of USJC. The collaboration between Denso and USJC is supported by the renovation and decarbonization program for indispensable semiconductors of Japan’s Ministry of Economy, Trade and Industry.
Keyword: Denso, USJC team up for automotive power semiconductors