Image: BoschSiC chips are used in the power electronics of electric vehicles. They are primarily deployed in the inverter (power converter), which acts as the link between the battery—operating on direct current—and the electric motor—operating on alternating current. Here, SiC chips ensure the battery’s power is converted as efficiently as possible for the motor.With its third generation of SiC chips, Bosch aims to deliver a significant efficiency improvement for its automotive industry customers.“Our next-generation chips deliver 20 per cent higher performance and are also significantly smaller than the previous generation,” said Markus Heyn, Bosch Executive Director and Chairman of the Bosch Mobility business sector. “This miniaturisation is the key to greater cost efficiency, as we can produce many more chips per wafer. That means we’re playing a key role in making high-performance electronics more widely available.”The supplier has already begun supplying global automotive manufacturers with samples of the third-generation SiC chips. “Silicon-carbide semiconductors are the key drivers of electromobility. They control the flow of energy and make it as efficient as possible. With our next-generation SiC chips, we’re systematically expanding our technological leadership in this field and helping our customers put even more powerful and efficient electric vehicles onto the road,” Heyn added.According to Bosch, the company has already delivered more than 60 million SiC chips worldwide since the launch of the first generation in 2021. To produce even more SiC chips in the future, the global corporation, based in Gerlingen near Stuttgart, is currently expanding its manufacturing and cleanroom capacities.The production of the third-generation SiC chips takes place at the semiconductor plant in Reutlingen using modern 200-millimetre wafers. Bosch has recently invested around three billion euros in semiconductors as part of the European IPCEI (Important Projects of Common European Interest) funding programmes for microelectronics and communication technology.In September 2023, Bosch acquired a second plant for SiC chip production in Roseville, California, and is currently equipping it with new production facilities. The supplier is investing around 1.9 billion euros in the US plant. The first SiC chips are expected to be manufactured and delivered there as early as 2026, initially as samples for customer testing.“In the future, Bosch will supply its innovative SiC chips from these two fabs in Germany and the US,” said Heyn. This is intended to ensure more robust and resilient supply chains in the rapidly growing electrification of the automotive industry. In the medium term, Bosch aims to increase its production capacity for SiC power semiconductors to a mid-three-digit million range.Furthermore, Bosch, Infineon, and NXP have each acquired a 10 per cent stake in the TSMC chip factory in Dresden, which is currently under construction and is being funded by the German government with up to five billion euros. However, this facility will focus on conventional silicon semiconductors, which are required in vehicles for microcontrollers, infotainment, advanced driver-assistance systems (ADAS), and connectivity (IoT).bosch-presse.de
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